| Item | Description | Techonical Data |
| 1 | Layers | 1-30 Layers |
| 2 | Max. Board Size | 864 x 610 mm (34" x 24") |
| 3 | Min. Board Thickness | 0.2mm (2 layers) / 0.4mm (4 layers) / 0.9mm(8 layers) / 1.2mm (10 layers) / 1.3mm (12 layers) / 1.5mm (14 layers) / 1.7mm (16 layers) / 1.8mm / 2.0 mm (18 layers) / 2.2mm (20 layers) / 2.4mm ( 22 layers) / 2.6mm (24 layers) |
| 4 | Max. Board Thickness | 240mil(6mm) |
| 5 | Max. Copper Thickness | 6OZ |
| 6 | Min. Inner Line Width / Space | 4mil(0.1mm) / 4mil(0.1mm) |
| 7 | Min. Outer Line Width / Sapce | 4mil(0.1mm) / 3.5mil(0.089mm) |
| 8 | Min. Finish Hole Size | 8mil(0.2mm) |
| 9 | Max. Aspect ratio | 10:1 |
| 10 |
Min.Via/Pad |
via: dia. 0.2mm / pad: dia. 0.4mm ; HDI <0.10mm via |
| 11 | Board thickness tolerance | ±10%（≥1.0mm）；±0.1mm（≤1.0mm） |
| 12 | Finished hole size tolerance(PTH) | ±3mil(0.075mm)；press fit：±2mil(0.05mm) |
| 13 | Finished hole size tolerance(NPTH) | ±2mil(0.05mm) |
| 14 | PTH hole copper thickness | mini 25um(1.0mil) |
| 15 | Hole Position Deviation | ±2mil(0.05mm) |
| 16 | Outline Tolerance | ±4mil(0.1mm) |
| 17 | S/M Pitch | 3mil(0.08mm) |
| 18 | Insulation Resistance | 1 × 1012Ω |
| 19 | Thermal Shock |
3 × 10Sec@288 ℃ |
| 20 | Warp and Twist | ≤0.5% |
| 21 | Peel Strengh | 1.4N / mm |
| 22 | Solder Mask Abrasion | ≥6H |
| 23 | Flammability | 94V - O |
| 24 | Impedance Control | ±5% |
| 25 |
Mini Solder mask Opening |
0.05mm(2mil) |
| 26 | Mini solder mask coverage | 0.05mm(2mil) |
| 27 | Mini solder dam | 0.076mm(3mil) |
| 28 | Surface Finish Treatment |
Flash gold (Electrolytic); Electroless nickel Immersion gold (Electroless Ni/Au); Organic Solderability Preservatives (OSP or Entek), Hot Air Leveling (=HAL-Tin/Lead); Hot Air Leveling (Lead- Free, RoHS); Carbon Ink, Peelable Mask, Gold Fingers (30µ"), Immersion Silver (3~10u"), Immersion Tin (0.6~1.2um). |
| 29 | G/F Au thickness | 0.76um max ( 30u” max ) |
| 30 | V-cut angle | 30° 45° 60° ,tolerence +/- 5° |
| 31 | Mini V-cut board thickness | 0.8mm |
| 32 | V-cut remain thickness tolerance | ±0.1mm |
| 33 | Profiling mode | Routing & Punching |
| 34 | Profiling tolerance | ±0.1mm(4mil) |
| 35 | E-TEST voltage | 250 ± 5 V |
| 36 | Capacity | 250,000 square feet (Month) |
