Buried&Blind Via PCB-Shenzhen Sophic Circuits Co.,Ltd

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86(755) 2696 5393

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Buried&Blind Via PCB

Product Details
Number of plies：6layer
Material：FR4

Thickness of plating：1.2mm

Surface finish:ENIG

Minimum-value aperture：0.2mm

Size：175mm*112mmm

Special process:blind via

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Shenzhen Sophic Circuits Co.,Ltd